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Multi-layer PCBHigh frequency board Metal based (core) PCBThick copper PCBBlind & Buried vias PCBCeramic based PCBRigid-flex PCBSpecial products

IC test board

Max board thickness:6.0mm

Max aspect ratio:25:1

Max gold thickness:80 u''

Warpage:≤4‰

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High-density multilayer board

Min line width/space:3mil

Min hole size:0.2mm

Impedance control tolerance:±10%

Max layer count:56

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Ceramic based PCB

Min hole size:0.1mm

Metallization Process:DPC, DBC, COB

Finish board thickness:15um-200um

Surface finish:ENIG, Immersion silver

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Blind & Buried vias PCB

Layer count:12 layer

Aspect ratio:12

Min hole size:0.15mm

Line width/space:4/4mil

Blind vias:1-2/1-3/1-4/1-5

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Partially embedded AIN board

Material:AIN

Embedded Ceramic size:20*20(mm)

Professional technical support for thermal management:

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Rigid-flex PCB

Flexiable layers:8

Max layer count:16

Min line width/space:4mil

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